Hbm system architect
Company: Micron
Location: Boise
Posted on: April 19, 2024
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Job Description:
Our vision is to transform how the world uses information to
enrich life for all.Micron Technology is a world leader in
innovating memory and storage solutions that accelerate the
transformation of information into intelligence, inspiring the
world to learn, communicate and advance faster than ever.Our
Opportunity Summary: For more than 43 years, Micron Technology,
Inc.has redefined innovation with the world's most advanced memory
and semiconductor technologies.We're an international team of
visionaries and scientists, developing groundbreaking technologies
that are transforming how the world uses information to enrich
life.As an HBM System Architect, you will be tasked with conducting
in-depth architectural analysis and performance modeling of memory
components and systems.Your role will involve identifying potential
bottlenecks and proposing design improvements to optimize memory
performance.This will necessitate a proven understanding of areas
such as DRAM memory subsystems, DRAM controllers, DFI, and
industry-standard memory interfaces and protocols.You will be part
of a highly multi-functional team of technical guides,
collaborating closely with a distributed team of Design
Engineering, Product Engineering, Process Development, Package
Engineering, and Business Units to ensure the success of our future
HBM roadmap.The seniority level offered will be based on a
combination of experience and education.In HBM DEG (High Bandwidth
Memory - DRAM Engineering Group), we innovate and integrate
end-to-end groundbreaking front-end and backend processes with
groundbreaking design, debugging various tests, and qualification
techniques to develop the lowest power per bit solutions to improve
customer experience in the field of ML (Machine Learning) and AI
(Artificial Intelligence).The success of a sophisticated product
such as HBM relies vastly on vertical integration and the various
engineering working in unison.To provide greater detail, our HBM
technology pertains to stacking numbers of DRAM chips along with a
logic chip within one package through an assembly technology called
TSV (Through Silicon Via).This greatly increases the memory density
in a package, while allowing very high-speed signal
transmission.Furthermore, "high bandwidth"; is an outstanding
memory design area where custom gate-level design and RTL style
logic design are blended into the same product, and most of the DDR
or LPDDR design is based on the gate-level design only.Lastly,
verification and testing (validation) of HBM is the most ambitious
due to the total size of the design and complexity of the
functions, and in addition to craft, many innovations are needed
for verification and validation of the HBM product, thereby making
it uniquely exciting.Our team vision is a continuing desire to
develop your skills working in an inclusive diverse environment of
multicultural Teams across worldwide geographies! Enabling the
creative career path you deserve with a collaborative environment
and groundbreaking technology and growing upon your imagination and
creativity.(Disclaimer): While you may not exhibit all of the
characteristics/skills listed below today, we are highly interested
in a teammate who is motivated to grow in technical breadth and
depth.Suppose you are open to learning while being a valued member
of a team of best-in-class engineers.In that case, we are
determined to help build upon your existing foundation, while
rapidly growing your individual and collaborative skills in this
exciting and outstanding opportunity.What's Encouraged Daily:
Conduct architectural analysis, performance modeling, and
simulations of memory components and/or systems to identify
bottlenecks and propose design improvements.Perform C++ performance
modeling of proposed architectural solutions and
features.Collaborate with multi-functional teams to develop
architectural solutions.Analyze and present results meticulously to
enable data-specific architecture/design decisions.How To Qualify:
BS or MS with 3+ years of relevant Engineering experience, or NCG
Ph.D.with related experience Experience with memory performance
analysis, modeling, and simulation tools (e.g., Ramulator,
DRAMSim).Experience with GPU/CPU performance analysis, modeling,
and simulation tools (e.g., GPGPU, GEM5).Excellent C/C++/scripting
coding, debugging, and testing skills.Good understanding of
computer architecture, memory systems, and memory technologies.What
Sets You Apart: Solid understanding of memory controller designs,
cache coherence protocols, and memory management
techniques.Familiarity with industry-standard memory interfaces and
protocols, such as LPDDR, DDR, HBM, GDDR, CXL, UCIe, and PCIe.Prior
experience in writing a CPU/GPU and/or memory simulator using C++
Possess knowledge in one or more areas such as DRAM memory
subsystem, DRAM controller, and DFI.Excellent problem-solving and
analytical skills.A self-motivated, enthusiastic team player who
enjoys working with others.Good communication skills with the
ability to convey complex technical concepts to other design and
verification peers in verbal and written form.Having an innovative
approach that is open to improving upon any of our processes or
products.Potential Team Member Locations: Boise, ID Allen, TX
Folsom, CA The US base salary range that Micron Technology
estimates it could pay for this full-time position is: $79,000.00 -
$227,000.00 Our salary ranges are determined by role, level, and
location. The range displayed on each job posting reflects the
minimum and maximum target for new hire salaries of the position
across all US locations. Within the range, individual pay is
determined by work location and additional job-related factors,
including knowledge, skills, experience, tenure and relevant
education or training. The pay scale is subject to change depending
on business needs. Your recruiter can share more about the specific
salary range for your preferred location during the hiring
process.Additional compensation may include benefits, discretionary
bonuses and equity.As a world leader in the semiconductor industry,
Micron is dedicated to your personal wellbeing and professional
growth.Micron benefits are designed to help you stay well, provide
peace of mind and help you prepare for the future.We offer a choice
of medical, dental and vision plans in all locations enabling team
members to select the plans that best meet their family healthcare
needs and budget. Micron also provides benefit programs that help
protect your income if you are unable to work due to illness or
injury, and paid family leave.Additionally, Micron benefits include
a robust paid time-off program and paid holidays.For additional
information regarding the Benefit programs available, please see
the Benefits Guide posted on micron.com/careers/benefits.Micron is
proud to be an equal opportunity workplace and is an affirmative
action employer.All qualified applicants will receive consideration
for employment without regard to race, color, religion, sex, sexual
orientation, age, national origin, disability, protected veteran
status, gender identity or any other factor protected by applicable
federal, state, or local laws.To learn about your right to work
click here.To learn more about Micron, please visit
micron.com/careers US Sites Only: To request assistance with the
application process and/or for reasonable accommodations, please
contact Micron's People Organization at hrsupport_na@micron.com or
1-800-336-8918 (select option #3) Micron Prohibits the use of child
labor and complies with all applicable laws, rules, regulations,
and other international and industry labor standards.Micron does
not charge candidates any recruitment fees or unlawfully collect
any other payment from candidates as consideration for their
employment with Micron.
Keywords: Micron, Caldwell , Hbm system architect, Other , Boise, Idaho
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